Apparently you are unaware of the shit storm that’s been Nvidia lately.
Oh, NVIDIA have always been a shitstorm. From making defective PS3 GPUs (the subject of this meme) to the constant hell that is their Linux drivers to melting power connectors, I am astounded anyone trusts them to do anything.
CEO Jensen Huang after reading your disparaging remarks about his company:
Those leather jackets won’t buy themselves!
It’s more: making their cards competitive on price and performance lately for team red
AMD have been amazing lately. 9070 XT makes buying most other cards in that price range pointless, especially with NVIDIA’s melting connectors being genuine hazards. ATI (who were dissolved in 2010 after being bought out by AMD) and NVIDIA in the mid to late 2000s however were dumpster fires in their own ways.
Depends if you can actually find a 9070XT at the price they advertised it at. Once that happens I’ll be convinced, right now though that’s very much felt like a bit of a bait and switch. Holding out hope though.
Are you referring to the red ring of death on the Xbox? Because that has absolutely nothing to do with ATI. They just made the chips, it’s Microsoft that put them on the board. Most of the issues were caused by a poor connection between the chip and the board, not a hell of a lot ATI could do about that.
A lot of it was engineers underestimating the effect of thermals between 80 and 95 degrees for very long times, with cool down cycles in between. The thinking was this was just fine and wouldn’t be an issue. It turned out it was an issue, so they learnt from that and later generations didn’t really have that issue.
As far as I am aware, the 360 GPUs had faulty solder connections (due to poor underfill choice by ATI that couldn’t withstand the temperature) between the chips and the interposer, not the interposer and the board, shown by the fact that a lot of red ring 360s show eDRAM errors (i.e. can’t communicate to the module on the same interposer, ruling out poor board connections). Microsoft even admitted this in a documentary they made (link), where they said it wasn’t the board balls, it was the GPU to interposer balls. A similar underfill choice is also why there are slightly higher failure rates of early Wiis, although nowhere near as bad as 360 due to the low power of the GPU on there.
I thought tsmc chose the poor underfill.
It’s hard to say for certain whose final call it was to do this underfill (it’s a tossup between ATI’s design engineers and the packaging partner they chose to work with to get the TSMC chip into a final product), but at the end of the day it was ATI’s responsibility to validate the chip and ensure its reliability before shipping it off to Microsoft.
